MBR150 datasheet(3/5 Pages) ONSEMI

3 / 5 page

MBR150, MBR160

http://onsemi.com

THERMAL CHARACTERISTICS

Figure 4. Thermal Response

0.1

0.2

0.5

1.0

2.0

5.0

100

200

500

1 k

2 k

5 k

10 k

0.07

0.05

0.03

0.02

0.01

0.1

t, TIME (ms)

0.7

0.5

0.3

0.2

1.0

ZqJL(t) = ZqJL • r(t)

Ppk

TIME

DUTY CYCLE, D = tp/t1

PEAK POWER, Ppk, is peak

of an equivalent square

power pulse.

DTJL = Ppk • RqJL [D + (1 − D) • r(t1 + tp) + r(tp) − r(t1)] where

DTJL = the increase in junction temperature above the lead

temperature r(t) = normalized value of transient thermal resistance

at time, t, from Figure 4, i.e.: r(t) = r(t1 + tp) = normalized value of

transient thermal resistance at time, t1 + tp.

Figure 5. Steady−State Thermal Resistance

Figure 6. Typical Capacitance

3/4

L, LEAD LENGTH (INCHES)

VR, REVERSE VOLTAGE (VOLTS)

3/8

1/8

1/4

1/2

5/8

7/8

1.0

100

200

BOTH LEADS TO HEATSINK,

EQUAL LENGTH

MAXIMUM

TYPICAL

100

TJ = 25°C

f = 1 MHz

NOTE 1. — MOUNTING DATA:

Data shown for thermal resistance junction−to−ambient

(RqJA) for the mounting shown is to be used as a typical

guideline values for preliminary engineering or in case the

tie point temperature cannot be measured.

Typical Values for RqJA in Still Air

Mounting

Method

Lead Length, L (in)

RqJA

1/8

1/4

1/2

3/4

°C/W

100

°C/W

—

°C/W

NOTE 2. — THERMAL CIRCUIT MODEL:

(For heat conduction through the leads)

TA(A)

TA(K)

TL(A)

TC(A)

TC(K)

TL(K)

RqS(A)

RqL(A)

RqJ(A)

RqJ(K

)

RqL(K)

RqS(K)

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