CS8161

http://onsemi.com

9

Heat Sinks

A heat sink effectively increases the surface area of the

package to improve the flow of heat away from the IC and

into the surrounding air.

Each material in the heat flow path between the IC and the

outside environment will have a thermal resistance. Like

series electrical resistances, these resistances are summed to

R

qJA + RqJC ) RqCS ) RqSA

(3)

where:

functions of the package type, heatsink and the interface

between them. These values appear in heat sink data sheets

of heat sink manufacturers.

MARKING DIAGRAMS

A

= Assembly Location

WL

= Wafer Lot

YY

= Year

WW

= Work Week

G

= Pb−Free Package

TO−220 5−LEAD

CS

8161

AWLYWWG

1

CS8161

AWLYWWG

1

CS

8161

AWLYWWG

1

ORDERING INFORMATION*

Device

Package

Shipping

CS8161YT5

TO−220

STRAIGHT

50 Units / Rail

CS8161YT5G

TO−220

STRAIGHT

(Pb−Free)

CS8161YTVA5

TO−220

VERTICAL

CS8161YTVA5G

TO−220

VERTICAL

(Pb−Free)

CS8161YTHA5

TO−220

HORIZONTAL

CS8161YTHA5G

TO−220

HORIZONTAL

(Pb−Free)

*Consult your local sales representative for SO−16L package option.