CS5201−3

http://onsemi.com

2

MAXIMUM RATINGS

Parameter

Value

Unit

7.0

V

Operating Temperature Range

−40 to +70

°C

Junction Temperature

150

°C

Storage Temperature Range

−60 to +150

°C

Lead Temperature Soldering:

Wave Solder (through hole styles only) (Note 1)

Reflow (SMD styles only) (Note 2)

260 Peak

230 Peak

°C

°C

ESD Damage Threshold (Human Body Model)

2.0

kV

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. 10 second maximum.

2. 60 second maximum above 183°C.

Characteristic

Test Conditions

Min

Typ

Max

Unit

Fixed Output Voltage

Reference Voltage (Notes 3 and 4)

3.250

(−1.5%)

3.300

3.350

(+1.5%)

V

Line Regulation

−

0.02

0.20

%

Load Regulation (Notes 3 and 4)

−

0.04

0.4

%

Dropout Voltage (Note 5)

−

1.0

1.2

V

Current Limit

1.0

3.1

−

A

Quiescent Current

−

5.0

10

mA

Thermal Regulation (Note 6)

−

0.002

0.020

%/W

Ripple Rejection (Note 6)

−

80

−

dB

Thermal Shutdown (Note 7)

−

150

180

210

°C

Thermal Shutdown Hysteresis (Note 7)

−

−

25

−

°C

3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output

voltage due to temperature changes must be taken into account separately.

4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package.

5. Dropout voltage is a measurement of the minimum input/output differential at full load.

6. Guaranteed by design, not 100% tested in production.

7. Thermal shutdown is 100% functionally tested in production.

PACKAGE PIN DESCRIPTION

Package Pin Number

Pin Symbol

Function

SOT−223

1

1

1

GND

Ground connection.

2

2

2

Regulated output voltage (case).

3

3

3

Input voltage.