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STR730FZ1T6 датащи(PDF) 49 Page - STMicroelectronics

номер детали STR730FZ1T6
подробное описание детали  ARM7TDMI 32-bit MCU with Flash, 3x CAN, 4 UARTs, 20 timers, ADC, 12 comm. interfaces
PDF  53 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STR730FZ1T6 датащи(HTML) 49 Page - STMicroelectronics

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STR73xF
Package characteristics
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4.2
Thermal characteristics
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using the
following equation:
TJ = TA + (PD x ΘJA)(1)
Where:
–TA is the Ambient Temperature in °C,
–
ΘJA is the Package Junction-to-Ambient Thermal Resistance, in °C/W,
–PD is the sum of PINT and PI/O (PD = PINT + PI/O),
–PINT is the product of IDD and VDD, expressed in Watt. This is the Chip Internal
Power,
–PI/O represents the Power Dissipation on Input and Output Pins; User Determined.
Most of the time for the applications PI/O< PINT and may be neglected. On the other hand,
PI/O may be significant if the device is configured to drive continuously external modules
and/or memories.
An approximate relationship between PD and TJ (if PI/O is neglected) is given by:
PD = K / (TJ + 273°C)
(2)
Therefore (solving equations 1 and 2):
K = PD x (TA + 273°C) + ΘJA x PD
2
(3)
Where:
–
K is a constant for the particular part, which may be determined from equation (3)
by measuring PD (at equilibrium) for a known TA. Using this value of K, the values
of PD and TJ may be obtained by solving equations (1) and (2) iteratively for any
value of TA
Table 26.
Thermal Characteristics
Symbol
Description
Package
Value (typical)
Unit
ΘJA
Thermal Resistance Junction-Ambient
LFBGA144
50
°C/W
TQFP144
40
TQFP100
40



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