6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

7

V

VI

Input voltage(2)

–0.5

VCC + 0.5

V

VO

Output voltage(2)

–0.5

VCC + 0.5

V

IIK

Input clamp current

VI < 0 or VI > VCC

±20

mA

IOK

Output clamp current

VO < 0 or VO > VCC

±20

mA

IO

Continuous output current

VO = 0 to VCC

±50

mA

Continuous current through VCC or GND

±200

mA

TJ

Absolute Maximum Junction Temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE

UNIT

SN74ACT244 in DW Package

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±2000

SN54ACT244 in J, W, DB, N, NS, PW, FK Packages

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage

4.5

5.5

V

VIH

High-level input voltage

2

V

VIL

Low-level input voltage

0.8

V

VI

Input voltage

0

VCC

V

VO

Output voltage

0

VCC

V

IOH

High-level output current

–24

mA

IOL

Low-level output current

24

mA

Δt/Δv

Input transition rise or fall rate

8

ns/V

TA

Operating free-air temperature

SN54ACT244

–55

125

°C

SN74ACT244

–40

85

(1)

All unused inputs of the device must be held at VCC or GND for proper device operation. See the TI application report, Implications of

Slow or Floating CMOS Inputs.

SN54ACT244, SN74ACT244

SCAS517E – JUNE 1995 – REVISED JULY 2023

www.ti.com

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