DA9278.004

13 July 2006

2 (5)

PIN DESCRIPTION

Pin Description

Symbol

x-coordinate

y-coordinate

Power Supply Voltage

VDD

177

172

Serial Bus Data Input

DA

435

1015

Serial Bus Clock Input

CLK

201

1015

Programming Input

PV

1042

1015

Voltage Control Input

VC

1012

158

Crystal Oscillator Output

X1

374

158

Power Supply Ground

VSS

830

1008

Crystal/Varactor Oscillator Input

X2

817

158

Buffer Output

OUT

665

1015

Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or

left floating. Make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are

recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location, however, distances between pads are accurate.

ABSOLUTE MAXIMUM RATINGS

Parameter

Symbol

Min

Max

Unit

Note

Supply Voltage

-0.3

6.0

V

Input Voltage

V

1)

Power Dissipation

20

mW

Storage Temperature

-55

150

Note: Not valid for programming pin PV.

RECOMMENDED OPERATION CONDITIONS

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

Supply Voltage

2.7

2.8

5.5

V

Supply Current

Vcc = 2.8 Volt

0.85

mA

Operating Temperature

-30

+85

Crystal Load Capacitance

7.0

pF