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SST12LP00 датащи(PDF) 12 Page - Silicon Storage Technology, Inc |
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SST12LP00 датащи(HTML) 12 Page - Silicon Storage Technology, Inc |
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12 / 14 page ![]() Preliminary Specifications 2.4-2.5 GHz Power Amplifier SST12LP00 ©2006 SST Communications Corp. S71283-01-000 3/06 12 PACKAGING DIAGRAMS FIGURE 14: 6-contact Very-thin Quad Flat No-lead (VQFN) SST Package Code: QV6 Note: 1. Although many dimensions are simliar to those of JEDEC JEP95 MO-220I, this specific package is not registered. 2. The external paddle is electrically connected to the die back-side and possibly to certain VSS leads. This paddle can be soldered to the PC board; it is suggested to connect this paddle to the VSS of the unit. Connection of this paddle to any other voltage potential can result in shorts and/or electrical malfunction of the device. 3. Untoleranced dimensions are nominal target dimensions. 4. All linear dimensions are in millimeters (max/min). See note 2 6-vqfn-3x1.6-QV6-0.0 0.5 BSC 0.475 0.076 0.2 1.60 ± 0.10 3.00 ± 0.10 0.05 Max 1.00 0.80 Pin #1 TOP VIEW BOTTOM VIEW SIDE VIEW 1mm 0.4 0.25 1 0.3 1.80 1.25 0.425 0.425 0.25 0.25 See paddle details Exposed Paddle Detail |
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