PESDXUSB30_SER

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Nexperia B.V. 2016. All rights reserved.

Product data sheet

Rev. 2 — 26 April 2016

13 of 19

Nexperia

PESDxUSB30 series

ESD protection for differential data lines

Fig 17. Package outline WLCSP15

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

PESD3USB30

pesd3usb30_po

Unit

mm

max

nom

min

0.60

0.38

2.42

1.22

0.80

A

Dimensions (mm are the original dimensions)

WLCSP15: wafer level chip-size package; 15 bumps (6-3-6)

PESD3USB30

A1

b

0.31

DE

e

e1

e2

0.80

e3

0.57

0.37

2.37

1.17

0.40

0.40

0.26

0.54

0.36

2.32

1.12

0.21

0

1 mm

scale

detail X

A

A1

D

E

bump A1

index area

bump A1

index area

X

e2

e

e1

e3

b

12

4

36

5

A

B

C

1/2 e

B1

B2

B3

16-01-19