MPQ8626 – 16V, 6A, HIGH EFFICIENCY SYNC, STEP-DOWN CONVERTER W/ ADJUSTABLE CURRENT LIMIT

MPQ8626 Rev. 1.1

www.MonolithicPower.com

4

8/16/2022

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ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage (VIN) .................................... 18V

VSW (DC) ..............................-0.3V to VIN + 0.3V

VSW (25ns)

(2) .....................................-3V to 25V

VSW (25ns)..........................................-5V to 25V

VBST ...................................................... VSW + 4V

VCC, EN ....................................... -0.3V to 4.5V

All other pins ..................................-0.3V to 4.3V

Junction temperature ................................170°C

Lead temperature .....................................260°C

Storage temperature ................ -65°C to +170°C

Recommended Operating Conditions

(3)

Supply voltage (VIN) ........................... 4V to 16V

VIN(DC) - VSW(DC)

(4) .................-0.3V to VIN + 0.3V

VSW(DC)

(5)..............................-0.3V to VIN + 0.3V

Output voltage (VOUT).........................0.6V to 6V

External VCC bias (VCC_EXT)..........3.12V to 3.6V

Maximum output current (IOUT_MAX)................. 6A

Maximum output current limit (IOC_MAX)........... 8A

Maximum peak inductor current (IL_PEAK) ..... 10A

EN voltage (VEN) ......................................... 3.6V

Operating junction temp. (TJ). .. -40°C to +125°C

Thermal Resistance

(6) θJB θJC_TOP

QNF-14 (2mmx3mm).......... 6.8 ...... 17.4... °C/W

NOTES:

1) Exceeding these ratings may damage the device.

2) Measured by using a differential oscilloscope probe.

3) The device is not guaranteed to function outside of its

operating conditions.

4) The voltage rating can be in the range of -5V to 24V for a

period of 25ns or less with a maximum repetition rate of 2MHz

when the input voltage is 16V.

5) The voltage rating can be in the range of -3V to 24V for a

period of 25ns or less with a maximum repetition rate of 2MHz

when the input voltage is 16V.

6)

θ

JB is the thermal resistance from the junction to the board

around the PGND soldering point.

θ

JC_TOP is the thermal resistance from the junction to the top of

the package.