MA780 – 8-BIT TO 12-BIT LOW-POWER ANGLE SENSOR

MA780 Rev. 1.2

MonolithicPower.com

3

8/30/2021

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PIN FUNCTIONS

Pin #

Name

I/O

Description

1

ND

O

New data. In ASC mode, ND indicates when new data is ready to be read. ND also

indicates if the displacement exceeds the defined threshold.

2

ERR

O

Error flag.

3

NVM

O

Non-volatile memory (NVM). This pin indicates when the chip is busy accessing the

NVM.

4

MOSI

I

Data in (SPI).

5

/CS

I

Chip selection (SPI).

6

ASC

I

Auto-sampling cycle. Connect the ASC pin to GND if it is not used.

7

MISO

O

Data out (SPI). MISO is pulled low when /CS is set to logic 1.

8

GND

N/A

Supply ground.

9

DV

O

Data valid. DV indicates whether the digital filter has been stabilized in active mode.

10

TEST

N/A

Connect to ground.

11

N/C

N/A

No connection. Do not make connections to this pin (internally connected).

12

SCLK

I

Clock (SPI).

13

VDD

N/A

3.3V supply.

14

VDDIO

N/A

1.8V to 3.3V supply for the IO. VDDIO allows for communication at voltages

between 1.8V and 3.3V.

15

EN

I

Enable. The EN pin switches the sensor to active mode. Connect EN to GND if it is

not used.

16

N/C

N/A

No connection. Do not make connections to this pin (internally connected).

ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage .............................-0.5V to +4.6V

Input pin voltage (VI) ....................-0.5V to +6.0V

Output pin voltage (VO) ................-0.5V to +4.6V

Continuous power dissipation (TA = 25°C) (2)

................................................................... 2.0W

Junction temperature ................................160°C

Lead temperature .....................................260°C

Storage temperature ................ -65°C to +150°C

ESD Ratings

Human body model (HBM) .......................... 2kV

Charged device model (CDM) ..................... 2kV

Recommended Operating Conditions

Supply voltage (VDD)……………….. 3.0V to 3.6V

I/O supply voltage (VDDIO)…………..1.8V to 3.6V

Operating temperature (TOP)…. -40°C to +125°C

Applied magnetic field (B)……. more than 30mT

Thermal Resistance (3)

θJA

θJC

QFN-16 (3mmx3mm)............. 50....... 12 ... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature, TJ (MAX), the junction-to-

ambient thermal resistance,

θ

JA, and the ambient temperature,

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA.

3) Measured on JESD51-7, 4-layer PCB.