MP6604A

– SIMPLE, DUAL H-BRIDGE DRIVER WITH SEPARATE IN AND EN PINS

MP6604A Rev. 1.1

MonolithicPower.com

15

5/12/2023

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APPLICATION INFORMATION

External Component Selection

Bypass the VIN pins to GND using a

≥100nF

ceramic capacitor with X7R dielectrics. Place

this capacitor as close to the IC as possible.

Place an additional 1µF to 10µF ceramic

capacitor

near

the

≥100nF

capacitor.

Depending on the supply impedance and

distance to other large capacitors, an additional

electrolytic bulk capacitor may be required to

stabilize VIN.

Connect a 100nF ceramic capacitor rated for

VIN between the CPA and CPB pins. Connect a

1µF ceramic capacitor between the VIN and

VCP pins. This capacitor should be rated for

≥16V.

Connect a 1µF ceramic capacitor with X7R

dielectrics between the VREG and GND pins.

This capacitor should be rated for ≥16V.

PCB Layout Guidelines

Efficient

PCB

layout

is

critical

for

stable

operation. For the best results, refer to Figure 3

and follow the guidelines below:

1. Place the VIN bypass capacitor and charge

pump capacitor as close to the IC as

possible. Place these capacitors adjacent to

the pins on the same PCB layer. Each VIN

pin should have a bypass capacitor.

2. Place as much copper as possible on the

long pads.

3. Place large copper areas on the pads, on

the same outer copper layer as the device.

4. Solder the thermal pad directly to the

copper on the PCB.

5. Add

multiple

thermal

vias

to

improve

thermal dissipation.

Recommended PCB Layout for the MP6604AGF

Recommended PCB Layout for the MP6604AGV

Figure 3: Recommended PCB Layout