MP6545

– 45V, 2.5A, SIMPLE THREE-PHASE POWER STAGE

MP6545 Rev. 1.1

MonolithicPower.com

4

5/12/2023

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ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage (VIN) ......................-0.3V to +48V

OUTx voltage (VOUT1, VOUT2, VOUT3)………………

………………………………………-0.7V to +48V

VCP, CPB .................................VIN to VIN + 6.5V

PGND to GND .............................-0.3V to +0.3V

All other pins to GND ...................-0.3V to +6.5V

Continuous power dissipation (TA = 25°C) (2)

QFN......……………………………………3.125W

TSSOP......…………………………………...3.9W

Storage temperature ................ -55°C to +150°C

Junction temperature ................................150°C

Lead temperature (solder) ........................260°C

ESD Ratings

Human body model (HBM) ........................ ±2kV

Charged device model (CDM) ................... ±2kV

Recommended Operating Conditions (3)

Supply voltage (VIN) .........................4.5V to 45V

PGND to GND .............................-0.2V to +0.2V

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance (4)

θJA

θJC

QFN-28 (4mmx5mm)...............40.........9....°C/W

TSSOP-28EP...........................32.........6...°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature, TJ (MAX), the junction-to-

ambient

thermal

resistance,

θ

JA,

and

the

ambient

temperature, TA. The maximum allowable continuous power

dissipation at any ambient temperature is calculated by PD

(MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum

allowable power dissipation can produce an excessive die

temperature, which may cause the regulator to go into

thermal

shutdown.

Internal

thermal

shutdown

circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, a 4-layer PCB.