MP2117

– 1.25MHZ, 2.2A SYNCHRONROUS STEP-DOWN SWITCHER

END OF LIFE, REFER TO MP1605

MP2117 Rev. 0.92

www.MonolithicPower.com

2

6/20/2022

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

© 2023 MPS. All Rights Reserved.

ORDERING INFORMATION

*For Tape & Reel, add suffix

–Z (eg. MP2117DQ–Z): For RoHS compliant packaging, add suffix –LF (eg.

MP2117DQ

–LF–Z). CONTACT FACTORY

**For Tape & Reel, add suffix

–Z (eg. MP2117DN–Z): For RoHS compliant packaging, add suffix –LF (eg.

MP2117DN

–LF–Z). CONTACT FACTORY

PACKAGE REFERENCE

QFN10 (3mmx3mm)

SOIC8E

ABSOLUTE MAXIMUM RATINGS (1)

IN to GND ..................................

–0.3V to + 6.5V

SW to GND ..........................

–0.3V to VIN + 0.3V

.....................(VSW >-2.5V, Transient <50ns ;

VSW<+8.5V, Transient <50ns)

PWROK to GND .........................

–0.3V to +6.5V

FB, EN to GND ...........................

–0.3V to +6.5V

Operating Temperature.............

–40°C to +85°C

Continuous Power Dissipation

(TA = +25°C) (2)

SOIC8E...................................................... 2.5W

QFN10 (3mm x 3mm) ................................ 2.5W

Junction Temperature ...............................150°C

Lead Temperature ....................................260°C

Storage Temperature .............

–65°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN .............................2.5V to 6V

Output Voltage VOUT...........................0.6V to 6V

Operating Temperature.............

–40°C to +85°C

Thermal Resistance

(4)

θJA

θJC

QFN10 (3mm x 3mm) .............50 ...... 12 ...

C/W

SOIC8E ...................................50 ...... 10 ...

C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD5 1-7, 4-layer PCB.

Part Number*

Package

Top Marking

Temperature

MP2117DQ

QFN10 (3mmx3mm)

S4

–40

C to +85C

Part Number**

Package

Top Marking

Temperature

MP2117DN

SOIC8E

MP2117DN

–40

C to +85C