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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ICP1240 датащи(PDF) 13 Page - Microchip Technology |
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ICP1240 датащи(HTML) 13 Page - Microchip Technology |
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13 / 17 page  6-18GHz 10W GaN PA MMIC ICP1240 Engineering Datasheet Rev F © 2023 Microchip Technology Inc. and its subsidiaries Page 13 Assembly Drawing Optimum RF power performance achieved by minimizing output RF bond wire length. Interconnect assembly Notes • Ball Bonding is preferred technique • Force, time and ultrasonic parameters are critical. • Aluminum wire bonding is not recommended. • Bond Wire diameter of 1mil is recommended. Die attach of component using adhesive • Vacuum collets are preferred method of pickup. • Pickup method must consider the avoidance of die air bridges. • Die suitable for Eutectic and Epoxy die attach. • Where Epoxy is used, high thermal conductivity Silver Sintered Epoxy is recommended:- • Namics H9889–1 • Kyocera CT2700R7S Die attach using Eutectic • Flux-less gold-tin (AuSn) (80% Au, 20% Sn with a melting point of 280ºC) preform is preferred between the die and attached surface. • Recommended preform should be approximately 0.0012” thick. • Die bonder using heated collet with a temperature of 310ºC and die scrubbing should be used to ensure wetting and prevent formation of voids. • Exposure to extreme temperature should be kept to a minimum. • The optimum die attach environment is nitrogen atmosphere. Reflow Process • Maximum temperature 320ºC for 30 seconds. • Material matching for coefficient of thermal expansion is crucial for long-term reliability Assembly Guidance Application Circuits PCB Construction Material Dimensions METAL1_TOP Cu + ENIG 1oz Cu plated Electroless Nickel 3-5µm DIELECTRIC RO4350C 10mils (254µm) METAL2_BOTTOM Cu + ENIG 1oz Cu plated Electroless Nickel 3-5µm Key Features Dimensions VIA Drill 0.3mm VIA Plating Thickness 50-70um 50 Ohm Line Width 525um PCB Fabrication |
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