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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ST72344 датащи(PDF) 180 Page - STMicroelectronics |
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ST72344 датащи(HTML) 180 Page - STMicroelectronics |
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180 / 191 page  ST72340, ST72344, ST72345 180/191 PACKAGE CHARACTERISTICS (Cont’d) Table 30. THERMAL CHARACTERISTICS Notes: 1. The maximum chip-junction temperature is based on technology characteristics. 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the application. 3. Values given for a 4-layer board. PDmax computed for TA = 125°C. Symbol Ratings Value 3) Unit RthJA Package thermal resistance (junction to ambient) LQFP32 60 °C/W LQFP44 54 LQFP48 73 TJmax Maximum junction temperature 1) 150 °C PDmax Power dissipation 2) LQFP32 415 mW LQFP44 460 LQFP48 340 |
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