 2019 Microchip Technology Inc.

DS20006084A-page 12

MIC4126/27/28

8-Lead SOICN ePad Package Outline and Recommended Land Pattern

© 2018 Microchip Technology Incorporated

C

SEATING

PLANE

END VIEW

BOTTOM VIEW

0.10 C

Microchip Technology Drawing C04-1136 Rev A Sheet 1 of 2

8X

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

8-Lead Small Outline Integrated Circuit Package (EQA) - 3.90 mm (1.50 In) Body [SOIC]

With 3.10x2.41 mm Exposed Pad

A1

A2

A

D

E

e

B

A

E1

E

2

E1

2

D1

E2

0.10 C

SIDE VIEW

TOP VIEW

0.18 C

2X

0.09 C D

2X

0.09 C A-B

2X

NOTE 1

D

h

h

SEE

DETAIL A