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UPC8002 датащи(PDF) 32 Page - Renesas Technology Corp

номер детали UPC8002
подробное описание детали  BIPOLAR ANALOG INTEGRATED CIRCUIT
PDF  34 Pages
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производитель  RENESAS [Renesas Technology Corp]
домашняя страница  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

UPC8002 датащи(HTML) 32 Page - Renesas Technology Corp

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µPC8002
30
11. RECOMMENDED SOLDERING CONDITIONS
The following conditions ( see table below) must be met when soldering this product.
For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL" (C10535E).
Please consult with our sales offices in case other soldering process or condition is used.
IR35-107-2
VP15-107-2
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions : 25 ˚C and relative humidity at 65 % or less.
Caution
Do not apply more than one soldering method at any one time, except for " Partial heating
method".
VPS
Peak package's surface temperature: 235 ˚C or below.
Reflow time : 30 seconds or below (210 ˚C or higher),
Number of reflow processes : MAX.2
Exposure limit Note : 7 days
(10 hours pre-baking is required at 125 ˚C afterwards)
Peak package's temperature: 215 ˚C or below.
Reflow time : 40 seconds or below (200 ˚C or higher),
Number of reflow processes : MAX. 2
Exposure limit Note : 7 days
(10 hours pre-baking is required at 125 ˚C afterwards)
Terminal temperature : 300 ˚C or below,
Time : 3 seconds or below (Per side of pin position)
TYPE OF SURFACE MOUNT DEVICE
Partial heating
method
Infrared Ray Reflow
µPC8002GR
Soldering process
Soldering conditions
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