Data Sheet G12649EJ5V0DS00

18

μPC494

μ PC494GT-A

Note1: 16-pin plastic SOP (9.53 mm (375))

Process

Conditions

Symbol

Infrared Ray Reflow

Maximum temperature (package’s surface temperature): 260

°C or below,

Time at maximum temperature: 10 seconds or less,

Time at temperature higher than 220

°C: 60 seconds or less,

Preheating time at 160 to 180

°C: 60 to 120 seconds, Times: 3 times,

Exposure limit: 7 days

Note2

(after that, prebake at 125

°C for 20 hours),

Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.

IR60-207-3

Wave Soldering

Solder temperature: 260

°C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Preheating temperature: 120

°C MAX. (Package surface temperature),

Exposure limit: 7 days

Note2

(after that, prebake at 125

°C for 20 hours).

WS60-207-1

Partial Heating Method

Pin temperature: 350°C or below,

Heat time: 3 seconds or less (Per each side of the device),

Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.

P350

Notes 1. Pb-free (This product does not contain Pb in the external electrode and other parts.)

2. After opening the dry pack, store it a 25

°C or less and 65% RH or less for the allowable storage period.

μ PC494GS-A

Note: 16-pin plastic SOP (7.62 mm (300))

Process

Conditions

Symbol

Infrared Ray Reflow

Maximum temperature (package’s surface temperature): 260

°C or below,

Time at maximum temperature: 10 seconds or less,

Time at temperature higher than 220

°C: 60 seconds or less,

Preheating time at 160 to 180

°C: 60 to 120 seconds, Times: 3 times,

Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.

IR60-00-3

Wave Soldering

Solder temperature: 260

°C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Preheating temperature: 120

°C MAX. (Package surface temperature).

WS60-00-1

Partial Heating Method

Pin temperature: 350°C or below,

Heat time: 3 seconds or less (Per each side of the device),

Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.

P350

Note Pb-free (This product does not contain Pb in the external electrode and other parts.)

Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the

device will be damaged by heat stress.