2000 Feb 14

3

Philips Semiconductors

Product specification

SMA ultra fast low-loss

controlled avalanche rectifiers

ES1 series

ELECTRICAL CHARACTERISTICS

THERMAL CHARACTERISTICS

Notes

2. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper

≥40 µm. For more

information please refer to the

‘General Part of associated Handbook’.

SYMBOL

PARAMETER

CONDITIONS

TYP.

MAX.

UNIT

forward voltage

−

1.1

V

reverse current

−

5

µA

−

100

µA

reverse recovery time

−

25

ns

diode capacitance

19

−

pF

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to tie-point; see Fig.7

27

K/W

thermal resistance from junction to ambient

note 1

100

K/W

note 2

150

K/W