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TOP242F датащи(PDF) 28 Page - Power Integrations, Inc. |
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TOP242F датащи(HTML) 28 Page - Power Integrations, Inc. |
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28 / 52 page ![]() TOP242-250 28 G 1/02 Table 4 (cont). Comparison Between TOPSwitch-II and TOPSwitch-GX. *Not available Function TOPSwitch-FX TOPSwitch-GX TOPSwitch-GX Advantages Light Load Operation Cycle skipping Frequency and Duty Cycle • Improves light load efficiency reduction • Reduces no-load consumption Line Sensing/Externally Line sensing and Line sensing and externally • Additional design flexibility allows all Set Current Limit externally set set current limit possible features to be used simultaneously (Y, R and F Packages) current limit simultaneously mutually (functions split onto exclusive (M pin) L and X pins) Current Limit 100-40% 100-30% • Minimizes transformer core size Programming in highly continuous designs Range TOPSwitch-FX vs. TOPSwitch-GX Table 5 compares the features and performance differences between TOPSwitch-GX and TOPSwitch-FX. Many of the new features eliminate the need for additional discrete components. Other features increase the robustness of design allowing cost savings in the transformer and other power components. Function TOPSwitch-II TOPSwitch-GX Figures TOPSwitch-GX Advantages Remote ON/OFF N/A* Single transistor 11, 22, • Fast on/off (cycle by cycle) or optocoupler 23, 24, • Active-on or active-off control interface or manual 25, 26, • Low consumption in remote off state switch 27, 29, • Active-on control for fail-safe 36, 37, • Eliminates expensive in-line on/off 38, 39, switch 40 • Allows processor controlled turn on/off • Permits shutdown/wake-up of peripherals via LAN or parallel port Synchronization N/A* Single transistor • Synchronization to external lower or optocoupler frequency signal interface • Starts new switching cycle on demand Thermal Shutdown 125 °C min. Hysteretic 130 °C• Automatic recovery from thermal Latched min. Shutdown (with fault 75 °C hysteresis) • Large hysteresis prevents circuit board overheating Current Limit Tolerance ±10% (@25 °C) ±7% (@25 °C) • 10% higher power capability due to -8% (0 °C to100 °C) -4% (0 °C to 100 °C) tighter tolerance DRAIN DIP 0.037" / 0.94 mm 0.137" / 3.48 mm • Greater immunity to arcing as a Creepage SMD 0.037" / 0.94 mm 0.137" / 3.48 mm result of build-up of dust, debris and at Package TO-220 0.046" / 1.17 mm 0.068" / 1.73 mm other contaminants DRAIN Creepage at 0.045" / 1.14 mm 0.113" / 2.87 mm • Preformed leads accommodate PCB for Y, R and F (R and F (preformed leads) large creepage for PCB layout Packages Package N/A*) • Easier to meet Safety (UL/VDE) Table 5. Comparison Between TOPSwitch-FX and TOPSwitch-GX. (continued on next page) |
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