PCA8575_1

© NXP B.V. 2006. All rights reserved.

Objective data sheet

Rev. 01 — 30 November 2006

21 of 30

NXP Semiconductors

PCA8575

Fig 24. Package outline SOT556-1 (SSOP24)

UNIT

A1

A2

A3

HE

Lp

bp

eL

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.25

0.10

1.55

1.40

0.25

0.31

0.20

0.25

0.18

8.8

8.6

4.0

3.8

0.635

1

6.2

5.8

0.89

0.41

1.05

0.66

8

0

o

o

8

0

o

o

0.18

0.25

0.1

DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

Note

1. Plastic or metal protrusions of 0.2 mm (0.008 inch) maximum per side are not included.

SOT556-1

99-12-27

03-02-18

D

E

Z

e

c

X

A

y

1

12

24

13

θ

A

detail X

L

(A )

3

MO-137

0

2.5

5 mm

scale

SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm

SOT556-1

A

max.

1.73

inches

0.0098

0.0040

0.061

0.055

0.01

0.012

0.008

0.0098

0.0075

0.344

0.337

0.157

0.150

0.025

0.041

0.244

0.228

0.035

0.016

0.040

0.026

0.007

0.01

0.004

0.068