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BAS16H датащи(PDF) 3 Page - NXP Semiconductors

номер детали BAS16H
подробное описание детали  High-speed switching diode in SOD123F package
PDF  10 Pages
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производитель  PHILIPS [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BAS16H датащи(HTML) 3 Page - NXP Semiconductors

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© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 15 April 2005
3 of 10
Philips Semiconductors
BAS16H
High-speed switching diode in SOD123F package
5.
Limiting values
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB) with 60
µm copper strip line.
[2]
Square wave; Tj = 25 °C prior to surge.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6.
Thermal characteristics
[1]
Device mounted on an FR4 PCB with 60
µm copper strip line.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
Table 5:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VRRM
repetitive peak reverse
voltage
-
100
V
VR
reverse voltage
-
100
V
IF
forward current
[1] -
215
mA
IFRM
repetitive peak forward
current
-
500
mA
IFSM
non-repetitive peak forward
current
tp = 50 µs
[2] -4
A
tp = 1 ms
[2] -2
A
tp = 10 ms
[2] -
1.5
A
Ptot
total power dissipation
[1] -
0.38
W
[3] -
0.83
W
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
Table 6:
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
[1] -
-
330
K/W
[2] -
-
150
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
--70
K/W



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