NCP5608

http://onsemi.com

5

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Power Supply

7.0

V

Digital Input Voltage

Digital Input Current

SDA, SCL

−

−0.3

1.0

V

mA

ESD Capability (Note 4)

Human Body Model (HBM)

Machine Model (MM)

2.0

200

kV

V

QFN24 Package

Thermal Resistance, Junction−to−Air (according to JEDEC/EIA JESD51−12)

250

160

mW

°C/W

Operating Ambient Temperature Range

−40 to +85

°C

Operating Junction Temperature Range

−40 to +125

°C

Maximum Junction Temperature

+150

°C

Storage Temperature Range

−65 to +150

°C

Latchup Current Maximum Rating (per JEDEC standard: JESD78) Class II

−

"100

mA

Moisture Sensitivity Level (Note 6)

MSL

1

−

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

4. This device series contains ESD protection and exceeds the following tests:

Human Body Model (HBM): JESD22−A114.

Machine Model (MM): JESD22−A115.

5. The maximum package power dissipation limit must not be exceeded.

6. Moisture Sensitivity Level (MSL): per IPC/JEDEC standard: J−STD−020A.