Specifications and information are subject to change without notice.

WJ Communications, Inc

• Phone 1-800- WJ1-4401 • FAX: 408-577-6621 • e- mail: sales@wj.com • Web site: www.wj.com

September 2004

FP2189

1 - Watt HFET

Product Information

FP2189-G (Green / Lead-free SOT-89 Package) Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260

°C reflow temperature) and leaded

(maximum 245

°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.

Outline Drawing

Land Pattern

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85

°C

Thermal Resistance, Rth

(1)

35

° C/W

Junction Temperature, Tjc

(2)

155

° C

1. The thermal resistance is referenced from the hottest

part of the junction to the ground tab (pin 4).

2. This corresponds to the typical drain biasing condition

of +8V, 250 mA at an 85

°C case temperature. A

minimum MTTF of 1 million hours is achieved for

junction temperatures below 160

°C.

Product Marking

The FP2189-G will be marked with an

“FP21G” designator.

An alphanumeric lot

code (“XXXX-X”) is also marked below the

part designator on the top surface of the

package.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

MSL / ESD Rating

ESD Rating: Class 1B

Value:

Passes

/500V to <1000V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value:

Passes at 2000 V min.

Test:

Charged Device Model (CDM)

Standard:

JEDEC Standard JESD22-C101

MSL Rating: Level 3 at +260

° C convection reflow

Standard:

JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper

performance of this device. Vias should use a .35mm

(#80 / .0135”) diameter drill and have a final plated

thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer

layers

near

the part to ensure optimal thermal

performance.

3. Mounting screws can be added near the part to fasten

the board to a heatsink.

Ensure that the ground /

thermal via region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board

in the region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material

and construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are

in degrees.

MTTF vs. GND Tab Temperature

0

1

10

100

60

70

80

90

100

110

120

Tab Temperature (°C)