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BLF145 датащи(PDF) 3 Page - NXP Semiconductors |
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BLF145 датащи(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() September 1992 3 Philips Semiconductors Product specification HF power MOS transistor BLF145 LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). THERMAL RESISTANCE SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDSS drain-source voltage − 65 V ±VGSS gate-source voltage − 20 V ID DC drain current − 6A Ptot total power dissipation up to Tmb = 25 °C − 68 W Tstg storage temperature −65 150 °C Tj junction temperature − 200 °C SYMBOL PARAMETER THERMAL RESISTANCE Rth j-mb thermal resistance from junction to mounting base 2.6 K/W Rth mb-h thermal resistance from mounting base to heatsink 0.3 K/W Fig.2 DC SOAR. (1) Current is this area may be limited by RDS(on). (2) Tmb =25 °C. handbook, halfpage 10−1 1 10 110 ID (A) VDS (V) 102 MRA901 (1) (2) Fig.3 Power/temperature derating curves. (1) Short-time operation during mismatch. (2) Continuous operation. handbook, halfpage 0 (1) 40 80 160 100 80 40 20 60 120 MGP035 Ptot (W) Th (°C) (2) |
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