HUM2010D datasheet(3/221 Pages) MICROCHIP

3 / 221 page

1 Test Site

1 Die Revision

Impacts to Data Sheet: None

Change Impact:None

Reason for Change: To improve productivity by standardizing the packing method as part of the integration of Microsemi

and Microchip.

Change Implementation Status:In Progress

Earliest Implementation Date:August 15, 2020 (Date code: 2033)

Note: The earliest implementation date is the earliest date that we may implement any combination of the changes listed

in this PCN as we will not implement any of the proposed changes prior to this date. After the earliest implementation date

these changes may occur to any product over the course of many months depending on inventory levels and business

conditions.

Time Table Summary:

July 2020

August 2020

Workweek

Final PCN Issue Date

Estimated

Implementation Date

Contact Microchip: Method to Identify Change: Traceability, label, inner and outer boxes.

You may contact your localMicrochip Sales and Distribution. Contact information is also provided on the attached

Frequently Asked Questions (FAQ).

If applicable, please also copy your local Microchip field sales and/or field quality representative.

Revision History: July 03, 2020: Issued final notification. Estimated First Ship date will be on August 15, 2020.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content

of the applicable products.

Attachments:

HUM2010D датащи(PDF) 3 Page - Microchip Technology