ADV7393EBZ datasheet(64/96 Pages) AD

64 / 96 page

ADV7390/ADV7391/ADV7392/ADV7393

Rev. 0 | Page 64 of 96

Power Supply Decoupling

It is recommended that each power supply pin be decoupled

with 10 nF and 0.1 μF ceramic capacitors. The VAA, PVDD,

VDD_IO, and both VDD pins should be individually decoupled to

ground. The decoupling capacitors should be placed as close as

possible to the ADV739x with the capacitor leads kept as short

as possible to minimize lead inductance.

A 1 μF tantalum capacitor is recommended across the VAA

supply in addition to the 10 nF and 0.1 μF ceramic capacitors.

Power Supply Sequencing

The ADV739x is robust to all power supply sequencing

combinations. Any particular sequence can be used.

Digital Signal Interconnect

The digital signal traces should be isolated as much as possible

from the analog outputs and other analog circuitry. Digital

signal traces should not overlay the VAA or PVDD power planes.

Due to the high clock rates used, avoid long clock traces to the

ADV739x to minimize noise pickup.

Any pull-up termination resistors for the digital inputs should

be connected to the VDD power supply.

Any unused digital inputs should be tied to ground.

Analog Signal Interconnect

DAC output traces should be treated as transmission lines with

appropriate measures taken to ensure optimal performance (for

example, impedance matched traces). The DAC output traces

should be kept as short as possible. The termination resistors on

the DAC output traces should be placed as close as possible to

and on the same side of the PCB as the ADV739x.

To avoid crosstalk between the DAC outputs, it is

recommended that as much space as possible be left between

the traces connected to the DAC output pins. Adding ground

traces between the DAC output traces is also recommended.

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