Pad Assignment

Chip size: 2135

´2385 (mm)

2

* The IC substrate should be connected to VSS in the PCB layout artwork.

Pad Coordinates

Unit:

mm

Pad No.

X

Y

Pad No.

X

Y

1

-876.150

1043.000

14

916.350

514.500

2

-876.150

931.200

15

916.350

625.100

3

-876.150

817.560

16

916.350

725.100

4

-876.150

715.600

17

916.350

835.700

5

-916.350

-63.124

18

916.350

935.700

6

-916.350

-740.976

19

916.350

1046.300

7

-916.350

-842.650

20

704.250

1041.550

8

-916.350

-942.650

21

593.650

1041.550

9

-916.350

-1044.324

22

493.650

1041.550

10

710.500

-1041.350

23

383.050

1041.550

11

810.500

-1041.350

24

283.050

1041.550

12

921.100

-1041.350

25

172.450

1041.550

13

916.350

414.500

HT3834

Rev. 1.00

2

November 2, 2006

2 2

2 3

P A 3

P A 4

P A 5

P A 6

P A 7

P B 6

P B 7

O S C 1

O S C 2

R E S

( 0 , 0 )

1

2

3

4

5

6

7

8

9

2 5 2 4

2 0

1 9

1 8

1 7

1 6

1 5

1 4

1 3

2 1

1 2

1 1

1 0

A U D

T E S T

V D D A

V S S A

V S S

V D D