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MF52B2104F3950 датащи(PDF) 2 Page - List of Unclassifed Manufacturers |
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MF52B2104F3950 датащи(HTML) 2 Page - List of Unclassifed Manufacturers |
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2 / 9 page ![]() 4.4 Thermal time constant τ In still air sec ≤7 4.5 Insulation resistance / 100V/DC 1min MΩ ≥100 4.6 Operating temperature / / ℃ -55 ~ 125 4.7 R&T-table / / / See attached table 4.8 Resistance tolerance / / / See attached curve 5、Reliability Item Test conditions and methods Technical requirements 5.1 Solderability The lead wire shall be dipped into solder bath of 235±5 for 2 ℃ ~3sec with 6mm space from the body. Solder dipped on lead wire should be uniform and smooth; the coverage area should be more than 95%. 5.2 Withstand Soldering heat The lead wire shall be dipped into solder bath of 265±5 for ℃ 5±1sec with 6mm space from the body. No obvious damage, R25 ΔR/R≤±2% 5.3 Terminal strength Pull strength:5N,time:10sec No obvious damage, R25 ΔR/R≤±2% 5.4 Temperature cycle -55℃30min→25℃5min→125℃30min →25℃5min, 5cycles ,recover 4hrs No obvious damage, R25 ΔR/R≤±2% 5.5 High temperature Temperature:125℃,time:16hrs No obvious damage, R25 ΔR/R≤±2% 5.6 Low temperature Temperature:-55℃,Time:2hrs No obvious damage, R25 ΔR/R≤±2% 5.7 Low atmospheric pressure Atmospheric pressure:40±0.1Kpa, time :4hrs No obvious damage, R25 ΔR/R≤±2% 5.8 Steady humidity and heat Temp:40℃,humidity:93%, Time :500±12hrs No obvious damage, R25 ΔR/R≤±2%, Withstanding voltage ≥700V/AC 1min Insulating resistance ≥100MΩ 5.9 Damp heat Temp:25~40℃,humidity:90%, Time:24hrs No obvious damage, R25 ΔR/R≤±2%, Withstanding voltage ≥700V/AC 1min Insulating resistance ≥100MΩ 5.1 0 Zero power endurance at upper category temperature Temp : 125℃±2℃, Time :1000±24hrs No obvious damage, R25 ΔR/R≤±2% 5.1 1 Vibrate Frequency :10~500HZ,swing :0.75m or 98m/S2,time :2hurs No obvious damage, R25 ΔR/R≤±2% 5.1 2 Bump Acceleration:250m/S2,pulse duration : 6mS,Bump times:4000times No obvious damage, R25 ΔR/R≤±2% |
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