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ABSOLUTE MAXIMUM RATINGS

PACKAGE DISSIPATION RATINGS

(1)

THERMAL CHARACTERISTICS

SN65MLVD2

SN65MLVD3

SLLS767 – NOVEMBER 2006

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

PART NUMBER

FUNCTION

PART MARKING

PACKAGE / CARRIER

SN65MLVD2DRBT

M-LVDS Type 1 Receiver

MF2

8-Pin SON / Small Tape and Reel

SN65MLVD2DRBR

M-LVDS Type 1 Receiver

MF2

8-Pin SON / Tape and Reel

SN65MLVD3DRBT

M-LVDS Type 2 Receiver

MF3

8-Pin SON / Small Tape and Reel

SN65MLVD3DRBR

M-LVDS Type 2 Receiver

MF3

8-Pin SON / Tape and Reel

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

VALUE

UNIT

–0.5 to 4

V

RE

–0.5 to 4

V

Input voltage range

A or B

–1.8 to 4

V

Output voltage range

R

–0.3 to 4

V

All other pins

±7

kV

A, B

±9

Electrostatic discharge

All pins

±200

V

All pins

±2

kV

Continuous power dissipation

See Dissipation Rating Table

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.

(3)

Tested in accordance with JEDEC Standard 22, Test Method A114-A. Bus pin stressed with respect to a common connection of GND

(4)

Tested in accordance with JEDEC Standard 22 Test Method A115-A.

(5)

Tested in accordance with EIA-JEDEC JESD22-C101C.

PACKAGE

PCB TYPE

POWER RATING

POWER RATING

Low-K

280 mW

2.80 mW/

°C

112 mW

8-SON DRB

High-K

662 mW

6.62 mW/

°C

264 mW

(1)

The thermal dissipations are in the consideration of soldering down the powerPAD without via on each type of boards.

(2)

This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

θ

JB

Junction-to-board thermal resistance

89

° C/W

θ

JC

Junction-to-case thermal resistance

98

° C/W

Device power dissipation

90

mW

3

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