8

LT5521

5521f

LO-RF Leakage vs LO Frequency

LO FREQUENCY (MHz)

1500

–36

–34

1900

5521 G28

–38

–40

1600

1700

1800

1550

1650

1750

1850

–32

–37

–35

–39

–33

85

°C

25

°C

–40

°C

LO POWER (dBm)

–25

4

6

8

0

5521 G29

2

0

–15

–5

–20

5

–10

10

–2

–4

10

21

23

25

19

17

15

13

27

IIP3

85

°C

25

°C

–40

°C

LO POWER (dBm)

–25

–36

–34

85

°C

–30

–10

0

5521 G30

–38

–40

–20

–15

–5

5

10

–42

–44

–32

25

°C

–40

°C

Conversion Gain and IIP3

vs LO Power

LO-RF Leakage vs LO Power

LO Leakage vs Supply Voltage

3.10

–2

0

2

4

6

3.20

IIP3

NF

3.30

3.40

3.50

5521 G31

8

4

12

8

16

20

24

3.15

3.25

3.35

3.45

85

°C

25

°C

–40

°C

Noise Figure vs LO Power

LO POWER (dBm)

–20

10

12

14

16

18

20

22

–15

–10

–5

0

5521 G32

5

85

°C

25

°C

–40

°C

3.0

–50

–44

–38

–32

3.1

3.2

3.3

3.4

5521 G33

3.5

–40

°C

85

°C

–26

–20

–47

–41

–35

–29

–23

3.6

25

°C

Conversion Gain, IIP3 and Noise

Figure vs Supply Voltage

PI FU CTIO S

GND (Pins 1, 4, 10, 11, 13, 14, 16): Ground. These pins

are internally connected to the Exposed Pad for improved

isolation. They should be connected to RF ground on the

printed circuit board, and are not intended to replace the

primary grounding through the backside of the package.

requires a resistive DC path to ground. See Applications

Information for choosing the resistor value. External match-

ing is required.

EN (Pin 5): Enable Input Pin. The enable voltage should be

at least 2.9V to turn the chip on and less than 0.2V to turn

the chip off.

for these three pins is 40mA.

have a DC connection to the supply voltage (see Applica-

tions Information). These pins draw 20mA each. External

matching is required.

LO (Pin 15): Local Oscillator Input. This input is internally

DC biased to 0.96V. Input signal must be AC coupled.

Exposed Pad (Pin 17): Circuit Ground Return for the

Entire IC. For best performance, this pin must be soldered

to the printed circuit board.