Conductive Polymer Aluminum Solid Capacitors

2.1 Soldering with a soldering iron

(1) When lead terminals for radial lead type must be processed because the lead pitch and the PCB holes do not match,

process them without any stresses to the OS-CON before soldering.

(2) Solder without any excessive stresses to the OS-CON itself.

(3) When the OS-CON has been soldered once and needs to be removed, remove it after the solder has been completely

melted.

(4) Do not let the tip of the soldering iron touch the OS-CON itself.

2.2 Flow soldering

(1) Do not apply flow soldering to OS-CON SMD type.

(2) Do not solder the OS-CON itself by submerging it in melted solder.

(3) Solder the opposite side that the OS-CON is mounted on.

(4) Note that flux does not adhere to anywhere expect the lead terminal.

(5) Note that other components do not fall over and touch the OS-CON when soldering.

2.3 Reflow soldering

(1) Do not apply reflow soldering to OS-CON Radial Lead type.

(2) Please contact us for setting VPS conditions.

2.4 Capacitor handling after soldering

Do not subject the OS-CON to excessive stress as follows.

(1) Do not tilt, bend or twist the OS-CON.

(2) Do not move the PCB with holding the OS-CON itself.

(3) Do not hit the OS-CON with objects.

(4) When stacking PCBs, make sure that the OS-CON does not touch other PCBs or components.

2.5 Circuit board cleaning

Check the following items before washing PC board with these detergents: high quality alcohol-based cleaning fluid

such as Pine-a ST-100S, clean thru 750H, 750L, 710M, 750K or Techno Care FRW 14 through 17 or detergents

including substitute freon as AK-225AES or IPA.

(1) Use immersion or ultrasonic waves to clean within 2 minutes.

(2) The temperature of the cleaning fluid should be less than 60 °C.

(3) Watch the contamination of the detergent such as conductivity, pH, specific gravity, water content, etc.

(4) Do not store the OS-CON in a location subject to gases from the cleaning fluid or in an airtight container after

cleaning.

(5) Dry the PCB or OS-CON with hot air that should be less than the upper category temperature.

(6) Please note that indication may disappear when rubbing print side after washing depending on a cleaner.

(7) Please contact us for details about detergents, cleaning methods and detergents other than those listed

above.

2.6 Fixatives and coating materials

(1) Select the appropriate covering and sealant materials for the OS-CON. In particular, don’t use acetone in the fixative,

coating agent and diluent.

(2) Before applying the fixative or coating, completely remove any flux residue and foreign matter from the area where

the board and the OS-CON will be jointed together.

(3) Allow any detergent to dry before applying the fixative or coating.

(4) Please contact us for the fixative and coating heat curing conditions.

2.7 Capacitor insulation

Be sure to completely separate the case, negative lead terminal, positive lead terminal and PC board patterns with each

other due to the following reasons.

(1) Insulation is not guaranteed at a part of resin on the surface of a case.

(2) It offers inconstant resistance between a case and a negative lead terminal and it isn’t insulated.

05-Mar-21

2. Mounting