©2005 Fujitsu Microelectronics America, Inc.

All company and product names are trademarks or

registered trademarks of their respective owners.

Printed in the U.S.A. WFS-FS-21139-9/2005

FUJITSU MICROELECTRONICS AMERICA, INC.

Corporate Headquarters

1250 E. Arques Ave. Sunnyvale, CA 94088-3470

Tel: (800) 866-8608 Fax: (408) 737-5999

E-mail: inquiry@fma.fujitsu.com Web Site: http://us.fujitsu.com/micro

65nm CMOS Technology, CS200 / CS200A

Technology Lineup

Fujitsu's foundry services offer an extensive IP

lineup, including CPU cores, image cores,

encryption, interface controllers and high-speed I/O,

all prepared for 65nm ASIC.

Fujitsu provides a one-stop, turnkey packaging

service, which includes package design, simulation,

assembly and testing. Packaging options include

standard BGA and Flip-Chip BGA (FC-BGA).

Fujitsu is the acknowledged global leader in

advanced packaging technology, innovation, patents

and manufacturing techniques.

IP Portfolio

Fujitsu provides two series of technology: CS200 for

high-end use such as high-performance server CPU

chips, and CS200A for low-power or mobile use.

The CS200A technology, in particular, provides a

great variety of transistors from low-leakage (LL)

for cellular phones to ultra-high-speed (UHS) for

servers or network devices. Customer can mix the

transistors in a chip to meet their needs.

The 65nm family consists of the low-power

CS200A and the high-performance CS200, giving

customers the flexibility to choose the appropriate

technology to differentiate their products. The HVt

(high Vth transistor) of the CS200 achieves higher

performance. The I/O ranges from 1.8V to 3.3V. For

the CS200A, 1.8 (2.5 or 3.3V) I/O-transistors can be

embedded in a chip. The SRAM memory cell size is

less than 0.6µm2.

SPICE simulations for some benchmarking circuits

show that the new product is 20 to 30% faster than

the previous version. The great performance

improvement is a result of Fujitsu's advanced tech-

nology, which was developed for the company's

high-performance servers. The chip size of the

CS200 is only 60% the size of CS100, when making

the same spec LSI, which is 4M gate logic and 2M

gate macro. (SRAM: 0.5Mbit, PLL, etc.)

CS200 Circuit Delay Performance (ps per gate)

CS200

CS100

Delay reduction

Inverter

5.7

7.0

77%

2-input NAND

8.7

11.4

69%

2-input NAND + 200-grid interconnect load

23.1

30.8

67%

CS200A: Wide Speed Range + Low Power Consumption

Speed

High End Server

STD-Tr

LL-Tr

Server/

Network

Digital Consumer

Cellular Phone

STD-Tr

HS-Tr

HV-Tr

Low Power

Lineup

CS200A

High

Performance

Lineup CS200

Mobile

Computing

UHS-Tr

Fast

UHS:Ultra high speed, HS:High speed

STD:Standard, LL:Low leakage

HS-Tr

CS200A: Wide Speed Range + Low Power Consumption

Speed

High End Server

STD-Tr

LL-Tr

Server/

Network

Digital Consumer

Cellular Phone

STD-Tr

HS-Tr

HV-Tr

Low Power

Lineup

CS200A

High

Performance

Lineup CS200

Mobile

Computing

UHS-Tr

Fast

UHS:Ultra high speed, HS:High speed

STD:Standard, LL:Low leakage

HS-Tr

Technology families

CS200A

CS200

Core

I/O

Standard

Vdd

UHS

HS

STD

LL

HVt

1.8V

2.5V

3.3V

3.3V LVt

6T Symmetry

1.2V

1.0V

x

xx

xx

x

x

xx

xx

x

x

0.535

µm2

0.595

µm2

SRAM