| поискавой системы для электроныых деталей |
|
ICS348-22 датащи(PDF) 4 Page - Renesas Technology Corp |
|
|
|||||||||||||||||||||||||||||
ICS348-22 датащи(HTML) 4 Page - Renesas Technology Corp |
|
4 / 9 page ![]() ICS348-22 QUAD PLL CLOCK SYNTHESIZER EPROM CLOCK SYNTHESIZER IDT™ / ICS™ QUAD PLL CLOCK SYNTHESIZER 4 ICS348-22 REV B 012005 External Components Series Termination Resistor Clock output traces should use series termination. To series terminate a 50 Ω trace (a commonly used trace impedance), place a 33 Ω resistor in series with the clock line, as close to the clock output pin as possible. The nominal impedance of the clock output is 20 Ω. Decoupling Capacitors Decoupling capacitors of 0.01µF must be connected between each VDD and the PCB ground plane. Crystal Load Capacitors The device crystal connections should include pads for small capacitors from X1 to ground and from X2 to ground. These capacitors are used to adjust the stray capacitance of the board to match the nominally required crystal load capacitance. Because load capacitance can only be increased in this trimming process, it is important to keep stray capacitance to a minimum by using very short PCB traces (and no vias) been the crystal and device. Crystal capacitors must be connected from each of the pins X1 and X2 to ground. The value (in pF) of these crystal caps should equal (CL -6 pF)*2. In this equation, CL= crystal load capacitance in pF. Example: For a crystal with a 16 pF load capacitance, each crystal capacitor would be 20 pF [(16-6) x 2] = 20. PCB Layout Recommendations For optimum device performance and lowest output phase noise, the following guidelines should be observed. 1) Each 0.01µF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible. No vias should be used between decoupling capacitor and VDD pin. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. 2) The external crystal should be mounted just next to the device with short traces. The X1 and X2 traces should not be routed next to each other with minimum spaces, instead they should be separated and away from other traces. 3) To minimize EMI, the 33 Ωseries termination resistor, if needed, should be placed close to the clock output. 4) An optimum layout is one with all components on the same side of the board, minimizing vias through other signal layers I |
|
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |