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ICS348-22 датащи(PDF) 4 Page - Renesas Technology Corp

номер детали ICS348-22
подробное описание детали  QUAD PLL CLOCK SYNTHESIZER
PDF  9 Pages
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производитель  RENESAS [Renesas Technology Corp]
домашняя страница  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

ICS348-22 датащи(HTML) 4 Page - Renesas Technology Corp

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ICS348-22
QUAD PLL CLOCK SYNTHESIZER
EPROM CLOCK SYNTHESIZER
IDT™ / ICS™ QUAD PLL CLOCK SYNTHESIZER
4
ICS348-22
REV B 012005
External Components
Series Termination Resistor
Clock output traces should use series termination. To
series terminate a 50
Ω trace (a commonly used trace
impedance), place a 33
Ω resistor in series with the
clock line, as close to the clock output pin as possible.
The nominal impedance of the clock output is 20
Ω.
Decoupling Capacitors
Decoupling capacitors of 0.01µF must be connected
between each VDD and the PCB ground plane.
Crystal Load Capacitors
The device crystal connections should include pads for
small capacitors from X1 to ground and from X2 to
ground. These capacitors are used to adjust the stray
capacitance of the board to match the nominally
required crystal load capacitance. Because load
capacitance can only be increased in this trimming
process, it is important to keep stray capacitance to a
minimum by using very short PCB traces (and no vias)
been the crystal and device. Crystal capacitors must be
connected from each of the pins X1 and X2 to ground.
The value (in pF) of these crystal caps should equal (CL
-6 pF)*2. In this equation, CL= crystal load capacitance
in pF. Example: For a crystal with a 16 pF load
capacitance, each crystal capacitor would be 20 pF
[(16-6) x 2] = 20.
PCB Layout Recommendations
For optimum device performance and lowest output
phase noise, the following guidelines should be
observed.
1) Each 0.01µF decoupling capacitor should be
mounted on the component side of the board as close
to the VDD pin as possible. No vias should be used
between decoupling capacitor and VDD pin. The PCB
trace to VDD pin should be kept as short as possible, as
should the PCB trace to the ground via.
2) The external crystal should be mounted just next to
the device with short traces. The X1 and X2 traces
should not be routed next to each other with minimum
spaces, instead they should be separated and away
from other traces.
3) To minimize EMI, the 33
Ωseries termination resistor,
if needed, should be placed close to the clock output.
4) An optimum layout is one with all components on the
same side of the board, minimizing vias through other
signal layers
I



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