© 2006 Microchip Technology Inc.

DS22001B-page 23

MCP1827/MCP1827S

3-Lead Plastic (EB) DDPAK

BOTTOM VIEW

TOP VIEW

E

D

b

b1

E1

D2

A

A1

c2

c

L

D1

e

α

φ

(5X)

L3

1

§ Significant Characteristic

Revised 07-19-05

Notes:

Mold Draft Angle

Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

α

7°

Pitch

Number of Pins

Overall Width

Standoff

§

Molded Package Length

Exposed Pad Width

Overall Height

MAX

Units

Dimension Limits

A1

E1

D

E

e

A

.000

.256 REF

INCHES*

1.00 BSC

MIN

3

NOM

MAX

.010

0.00

6.50 REF

MILLIMETERS

.183

MIN

3

2.54 BSC

NOM

0.25

4.65

JEDEC equivalent: TO-252

4.50

.170

.005

0.13

Foot Length

L

.068

--

.110

1.73

--

2.79

Foot Angle

φ

--

--

8°

b1

.049

.050

.051

1.24

1.27

1.30

.177

* Controlling Parameter

4.32

.385

.398

.410

9.78

10.11

10.41

Overall Length

D1

Upper Lead Width

Lead Thickness

c

.014

.020

.026

0.36

0.51

0.66

Pad Thickness

c2

.045

--

.055

1.14

--

1.40

Lower Lead Width

.037

b

.026

.032

0.66

0.81

0.94

3°

--

8°

7°

3°

--

--

--

Exposed Pad Length

D2

.303 REF

7.70 REF

Pad Length

L3

.045

--

.067

1.70

1.14

--

.370

.330

.350

9.40

8.38

8.89

.577

.549

.605

15.37

13.94

14.66

BSC: Basic Dimension. Theoretically, exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

See ASME Y14.5M

See ASME Y14.5M

Drawing No. C04-011

Note:

For the most current package drawings, please

see the Microchip Packaging Specification located

at http://www.microchip.com/packaging