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BFG11/X датащи(PDF) 3 Page - NXP Semiconductors |
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BFG11/X датащи(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() 1995 Apr 07 3 Philips Semiconductors Product specification NPN 2 GHz RF power transistor BFG11; BFG11/X LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter − 20 V VCEO collector-emitter voltage open base − 8V VEBO emitter-base voltage open collector − 2.5 V IC collector current (DC) − 500 mA IC(AV) average collector current − 500 mA Ptot total power dissipation up to Ts =60 °C; note 1; see Fig.2 − 400 mW Tstg storage temperature −65 +150 °C Tj junction temperature − 175 °C Fig.2 Power derating curve. handbook, halfpage 0 50 100 200 200 0 MLC818 150 T ( C) o s Ptot (mW) 300 500 400 100 THERMAL CHARACTERISTICS Note to the “Limiting values” and “Thermal characteristics” 1. Ts is the temperature at the soldering point of the collector pin. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-s thermal resistance from junction to soldering point up to Ts =60 °C; note 1; Ptot = 400 mW 290 K/W |
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