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REF35102QDBVR датащи(PDF) 11 Page - Texas Instruments |
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REF35102QDBVR датащи(HTML) 11 Page - Texas Instruments |
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11 / 38 page ![]() 7.6 Typical Characteristics (continued) at TA = 25°C, VIN = VEN = VREF + 0.3 V, IL = 0 mA, CL = 10 µF, CIN = 0.1 µF (unless otherwise noted) Frequency (Hz) 10 100 1000 10000 100000 1000000 1E+7 0 30 60 90 120 CIN=0.1F, CL=1F Figure 7-25. Power Supply Rejection Ratio (VREF = 2.5 V, IL = 0 mA) Frequency (Hz) 10 100 1000 10000 100000 1000000 1E+7 0.05 1 10 100 1000 10000 CL = 0.1 F CL = 1 F CL = 10 F Figure 7-26. Output Impedance Temperature ( C) -40 0 40 80 120 0 0.5 1 1.5 2 2.5 Figure 7-27. Quiescent Current vs Free-Air Temperature Figure 7-28. Dropout Voltage vs Free-Air Temperature Solder Heat Shift % 0 12 24 36 48 60 -0.03 -0.02 -0.01 0 0.01 0.02 0.03 Figure 7-29. Solder Heat Shift Distribution Time (hr) 0 400 800 1200 1600 2000 -200 -160 -120 -80 -40 0 40 80 120 160 200 Figure 7-30. Long Term Stability - 2000 hours (VREF) www.ti.com REF35 SNAS809A – DECEMBER 2021 – REVISED AUGUST 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: REF35 |
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