TLK2201A, TLK2201AI

ETHERNET TRANSCEIVERS

SLLS572 – JUNE 2003

16

POST OFFICE BOX 655303

APPLICATION INFORMATION

GND

GNDA

TESTEN

TD0–TD9

REFCLK

PRBSEN

17

22

16

SYNCEN

24

SYNC/PASS

47

10

10

RD0–RD9

2

RBC0–RBC1

ENABLE

28

TCK

49

JTMS

55

JTDI

48

JTRSTN

56

JTDO

27

LOS

26

RBCMODE

32

LOOPEN

19

MODESEL

15

Host

Protocol

Device

JTAG

Controller

VDD VDDA

2.5 V

VDDPLL

GNDPLL

5

Ω at 100 MHz

2.5 V

64

18

62

Controlled Impedance

Transmission Line

TXP

61

Controlled Impedance

Transmission Line

TXN

54

Controlled Impedance

Transmission Line

RXP

52

Controlled Impedance

Transmission Line

RXN

Rt

Rt

50

Ω

50

Ω

TLK2201A

TLK2201AI

0.01

µF

Figure 12. Typical Application Circuit (AC mode)

designing with PowerPAD

The TLK2201A and TLK2201AI are housed in a high performance, thermally enhanced, 64-pin VQFP (RCP64)

PowerPAD package. Use of the PowerPAD package does not require any special considerations except to note

that the PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical

conductor. Therefore, if not implementing PowerPAD PCB features, the use of solder masks (or other assembly

techniques) may be required to prevent any inadvertent shorting by the exposed PowerPAD of connection

etches or vias under the package. It is strongly recommended that the PowerPAD be soldered to the thermal

land. The recommended convention, however, is to not run any etches or signal vias under the device, but to

have only a grounded thermal land as explained below. Although the actual size of the exposed die pad may

vary, the minimum size required for the keepout area for the 64-pin PFP PowerPAD package is 8 mm

× 8 mm.