PowerPC 602 RISC Microprocessor Hardware Specifications

19

1.6.1.2 Mechanical Dimensions of the Motorola Wire-Bond PQFP Package

Figure 10 shows the mechanical dimensions for the Motorola wire-bond PQFP package.

Figure 10. Mechanical Dimensions of the Motorola Wire-Bond PQFP Package

Min.

Max.

A

27.90 28.10

B

31.10 31.37

C

3.45

3.85

D

0.65 BSC

E

0.22

0.38

F

3.17

3.67

G

0.25

0.35

H

0.75

0.92

J

0.25

.35

AA

1.60 REF

AB

.40

—

θ10°

—

θ20°

7

°

R

.13

.30

T

.13

—

Pin 144

C

A

B

Pin 1

DE

*Not to scale

F

J

Die

Wire Bonds

Plastic Body

Alloy 42 Leads

Notes:

1. BSC—Between Standard Centers.

2. All measurements in mm.

AB

θ1

AA

θ2

H

G

T

R

PRELIMINARY

Freescale Semiconductor, Inc.

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