CES2321

Electrical Characteristics TA = 25 C unless otherwise noted

Parameter

Symbol

Min

Units

Off Characteristics

Drain-Source Breakdown Voltage

Zero Gate Voltage Drain Current

Gate Body Leakage Current, Forward

Gate Threshold Voltage

Static Drain-Source

On-Resistance

BVDSS

IDSS

IGSSR

IGSSF

55

39

-0.4

-100

100

-1

mΩ

V

nA

nA

µ

A

V

2

Gate Body Leakage Current, Reverse

On Characteristics c

Dynamic Characteristics d

Input Capacitance

Reverse Transfer Capacitance

Output Capacitance

Switching Characteristics d

Turn-On Delay Time

Turn-Off Fall Time

Turn-Off Delay Time

Turn-On Rise Time

Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

Drain-Source Diode Characteristics and Maximun Ratings

Drain-Source Diode Forward Current b

Drain-Source Diode Forward Voltage c

Test Condition

VGS = 0V, ID = -250µA

VGS(th)

RDS(on)

Ciss

Coss

Crss

td(on)

tr

td(off)

tf

Qg

Qgs

Qgd

IS

VSD

Typ

Max

-20

VDS = -20V, VGS = 0V

VGS = 12V, VDS = 0V

VGS = -12V, VDS = 0V

VGS = VDS, ID = -250µA

VGS = -4.5V, ID = -2.4A

VGS = -2.5V, ID = -2.0A

VDD = -10V, ID =-3.8A,

VGS = -4.5V, RGEN = 3Ω

VDS = -10V, ID = -3.8A,

VGS = -4.5V

VDS = -10V, VGS = 0V,

f = 1.0 MHz

VGS = 0V, IS = -0.42A

840

140

105

11

5

33

8

22

10

66

16

9

1

2

12

-1

-1.2

62

47

mΩ

pF

pF

pF

ns

ns

ns

ns

nC

nC

nC

A

V

-1.0

Notes :

a.Repetitive Rating : Pulse width limited by maximum junction temperature.

b.Surface Mounted on FR4 Board, t < 5 sec.

c.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2%.

d.Guaranteed by design, not subject to production testing.