ISL70100SEHFSLASHPROTO datasheet(27/28 Pages) RENESAS

27 / 28 page

ISL70100SEH, ISL73100SEH

8. Package Outline Drawing

R34DS0009EU0101 Rev.1.01

Page 27 of 27

Jul.10.20

Package Outline Drawing

Notes:

1. Index area: A notch or a pin one identification mark shall be

located adjacent to pin one and shall be located within the

shaded area shown. The manufacturer’s identification shall not

be used as a pin one identification mark. Alternately, a tab

(dimension k) may be used to identify pin one.

2. If a pin one identification mark is used in addition to a tab, the

limits of dimension k do not apply.

3. This dimension allows for off-center lid, meniscus, and glass

overrun.

4. Dimensions b1 and c1 apply to lead base metal only. Dimension

M applies to lead plating and finish thickness. The maximum

limits of lead dimensions b and c or M shall be measured at the

centroid of the finished lead surfaces, when solder dip or tin plate

lead finish is applied.

5. N is the maximum number of terminal positions.

6. Measure dimension S1 at all four corners.

7. For bottom-brazed lead packages, no organic or polymeric

materials shall be molded to the bottom of the package to cover

the leads.

8. Dimension Q shall be measured at the point of exit (beyond the

meniscus) of the lead from the body. Dimension Q minimum

shall be reduced by 0.0015 inch (0.038mm) maximum when

solder dip lead finish is applied.

9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.

10. Controlling dimension: INCH.

-D-

-C-

0.004

H A - B

-A-

-B-

0.036

H A - B

SEATING AND

BASE PLANE

-H-

(c)

(b)

SECTION A-A

BASE

LEAD FINISH

METAL

PIN NO. 1

ID AREA

K10.A MIL-STD-1835 CDFP3-F10 (F-4A, CONFIGURATION B)

10 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

0.045

0.115

1.14

2.92

0.015

0.022

0.38

0.56

0.015

0.019

0.38

0.48

0.004

0.009

0.10

0.23

0.004

0.006

0.10

0.15

0.290

7.37

0.240

0.260

6.10

6.60

0.280

7.11

0.125

3.18

0.030

0.76

0.050 BSC

1.27 BSC

0.008

0.015

0.20

0.38

0.250

0.370

6.35

9.40

0.026

0.045

0.66

1.14

0.005

0.13

0.0015

0.04

N10

Rev. 0 3/07

For the most recent package outline drawing, see K10.A.

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