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ADN2530YCPZ-R2 датащи(PDF) 14 Page - Analog Devices |
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ADN2530YCPZ-R2 датащи(HTML) 14 Page - Analog Devices |
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14 / 20 page ![]() ADN2530 Rev. A | Page 14 of 20 P θJ-TOP TPAD TTOP TTOP θJ-PAD TPAD TJ A compact optical module is a complex thermal environment, and calculations of device junction temperature using the package θJA (junction-to-ambient thermal resistance) do not yield accurate results. The following equation, derived from the model in Figure 38, can be used to estimate the IC junction temperature: ( ) TOP J PAD J TOP J PAD PAD J TOP TOP J PAD J J T T P T − − − − − − θ + θ θ × + θ × + θ × θ × = Figure 38. Electrical Model for Thermal Calculations where: TTOP and TPAD can be determined by measuring the temperature at points inside the module, as shown in Figure 37. The thermo- couples should be positioned to obtain an accurate measurement of the package top and paddle temperatures. θJ-TOP and θJ-PAD are given in Table 2. TTOP is the temperature at top of package in degrees Celsius. TPAD is the temperature at package exposed paddle in degrees Celsius. TJ is the IC junction temperature in degrees Celsius. P is the ADN2530 power dissipation in watts. θJ-TOP is the thermal resistance from IC junction to package top. θJ-PAD is the thermal resistance from IC junction to package exposed pad. |
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