Series LB66B2

Technical

METAL CASE, CASE-MOUNTED

SEMICONDUCTORS

Part Number Series LB66B2

Natural Conv. (

°C/W): 19.7

Forced Air (

°C/W): 6.4

Mounting Envelope: 1.40" x 1.12" x .31"

DESCRIPTION OF CURVES

A.

B.

C.

D.

E.

N.C. Horiz. Device Only

Mounted to G-10.

N.C Horiz. & Vert. With

Dissipator.

200 FPM w/Diss.

500 FPM w/Diss.

1000 FPM w/Diss.

•

Thermal Resistance Case to Sink is 0.5-0.7

°C/W w/Joint Compound.

•

Derate 1.4

°C/watt for unplated part in natural convection only.