HIP0050

FN4034 Rev 0.00

Page 4 of 7

December 1996

FIGURE 1. LOGIC TIMING CONTROL WAVEFORMS

Pulse Width High

tW(SCKH)

-

27

175

ns

Pulse Width Low

tW(SCKL)

-

27

175

ns

SERIAL DATA IN (SI) (Refer to Figure 1 for Waveform Detail)

Input Setup Time

tSUI

-

1.1

75

ns

Input Hold Time

THI

-

1.5

75

ns

STROBE (STR)

Strobe Pulse Width

tW(S)

-

12

150

ns

Clock to Strobe Delay

tD(CS)

-

5

75

ns

SERIAL DATA OUT (SO) (Refer to Figure 1 for Waveform Detail)

Low Level Output Voltage

VOL

Sink Current = 1.6mA

-

0.2

0.4

V

High Level Output Voltage

VOH

Source Current = -1.6mA

3.7

4.4

-

V

Propagation Delay

tP(CD)

75

260

500

ns

PROTECTION PARAMETERS

Fault Output (FLT) Low

VOL

Sink Current = 1.6mA

-

-

0.4

V

Over-Temp. (OT) Shutdown

TSD

145

155

165

oC

OT Shutdown Hysteresis

TH

510

20

oC

NOTES:

1. The MOSFET Output Drain is internally clamped with a Drain-to-Gate Zener Diode that turns on the MOSFET; holding the drain at the

output clamp voltage VOC.

2. The HIP0050 Output Drive is protected by an internal current shutdown. The ICL over-current shutdown threshold parameter specification

defines the maximum current. The minimum limit for this threshold is 300mA. The maximum current with all outputs ON may be further

limited by dissipation.

3. Package dissipation is based on thermal resistance capability in a normal operating environment. The junction to ambient thermal resis-

tance values are defined here as a PC Board mounted device with minimal copper. Due to the heat conducting capability of the DIP and

SOIC package lead frames, 35oC/W thermal resistance can be achieved with approximately 2 square inches of 1 oz. copper PC Board

area. The junction to lead thermal resistance values are based on measurements from the chip to the ground leads of the package.

Electrical Specifications VCC = 4.5V to 5.5V, VBATT = 8V to 16V, TA = -40oC to 85oC; Unless Otherwise Specified (Continued)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

SCK (CLOCK)

SI (SERIAL DATA IN)

STR (STROBE)

DRx (POWER OUTPUT DRIVER)

SO (SERIAL DATA OUT)

tW(SCK)

tW(SCK)

tSUI

tHI

tD(CS)

tW(S)

tD(LH)

tD(HL)

t P(CD)

tFALL, tRISE

10%

90%