FN7013 Rev 3.00

Page 12 of 16

March 26, 2007

EL1507

Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted

in the quality certifications found at www.intersil.com/en/support/qualandreliability.html

Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such

modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are

current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its

subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or

otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

For additional products, see www.intersil.com/en/products.html

© Copyright Intersil Americas LLC 2005-2007. All Rights Reserved.

All trademarks and registered trademarks are the property of their respective owners.

FIGURE 47. OFFSET VOLTAGE vs TEMPERATURE

FIGURE 48. TRANSIMPEDANCE vs TEMPERATURE

FIGURE 49. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

FIGURE 50. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

Typical Performance Curves

10

-2

6

2

0

4

8

TEMPERATURE (°C)

-50

100

150

-25

0

50

125

25

75

3.5

0

2

3

1

0.5

1.5

2.5

TEMPERATURE (°C)

-50

100

150

-25

0

50

125

25

75

833mW

JA=150°C/W

QFN16

1.136W

JA=110°C/W

SO16

1.2

1

0.8

0.6

0.2

0

0

255075

100

150

AMBIENT TEMPERATURE (°C)

125

85

JEDEC JESD51-3 LOW EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

0.4

JEDEC JESD51-7 HIGH EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD - QFN EXPOSED

DIEPAD SOLDERED TO PCB PER JESD51-5

4.5

4

3

2

1

0.5

0

0

255075

100

150

AMBIENT TEMPERATURE (°C)

125

85

1.563W

JA=80°C/W

SO16

3.5

2.5

1.5

3.125W

JA=40°C/W

QFN16