SHT1x / SHT7x Relative Humidity & Temperature Sensor System
www.sensirion.com
v2.01 March 2003
8/9
5.2 SHT7x (4-pin single-in-line)
Table 11 SHT7x Pin Description
5.2.1
Package type1
The device is supplied in a single-in-line pin type package.
The sensor housing consists of a Liquid Crystal Polymer
(LCP) cap with epoxy glob top on a standard 0.6 mm FR4
substrate. The device is Cd and Hg free.
The sensor head is connected to the pins by a small bridge
to minimize heat conduction and response times. The gold
plated back side of the sensor head is connected to the GND
pin.
A 100nF capacitor is mounted on the back side between
VDD and GND.
All pins are gold plated to avoid corrosion. They can be
soldered or mate with most 1.27 mm (0.05’’) sockets
e.g.: Preci-dip / Mill-Max 851-93-004-20-001 or similar
Total weight: 168 mg, weight of sensor head: 73 mg
The production date is printed onto the cap in white numbers
in the form wwy. e.g. ”351” = week 35, 2001.
5.2.2
Delivery Conditions
The SHT7x are shipped in 32 mm tape. These reeled parts
in standard option are shipped with 500 units per 13 inch
diameter reel. Reels are individually labelled with barcode
and human readable labels.
Cover Tape
Carrier Tape
Leader Tape
500mm minimum
Trailer Tape
300mm minimum
Components
Figure 16 Tape configuration and unit orientation
5.2.3
Soldering Information
Standard wave SHT7x soldering ovens may be used at
maximum 235 °C for 20 seconds.
For manual soldering contact time must be limited to 5
seconds at up to 350 °C.
After wave soldering the devices should be stored at
>74 %RH for at least 24h to allow the polymer to rehydrate.
Please consult the application note “Soldering procedure” for
more information.
1
Other packaging options may be available on request.
Pin Name
Comment
1
SCK
Serial clock input
2
VDD
Supply 2.4 – 5.5 V
3
GND
Ground
4
DATA
Serial data bidirectional
3.7
1.27
5.08
1.2
0.46
2.2
3.1
0.6
0.2
2
(0.15)
(0.05)
(0.2)
(0.05)
(0.018)
(0.01)
(0.08)
(0.024)
(0.12)
(0.09)
12
4
3
Figure 17 SHT7x dimensions in mm (inch)
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