List of figures

Figure 1.

Module block schematic.............................................................. 3

Figure 2.

Module pins layout ................................................................. 3

Figure 3.

Module soldering profile graph ........................................................ 18

Figure 4.

Module carrier type specifications ...................................................... 19

Figure 5.

Module orientation specifications ...................................................... 19

Figure 6.

Module cover tape specifications ...................................................... 20

Figure 7.

Module plastic reel specifications ...................................................... 20

Figure 8.

Module PB band specifications ........................................................ 21

Figure 9.

Module labelling information .......................................................... 22

Figure 10.

LCC-18 (9.7 x 10.1 mm) package outline ................................................. 23

Teseo-LIV4F

List of figures

DS13957 - Rev 3

page 29/30