CD4512BMS

FN3340 Rev 0.00

Page 8 of 8

December 1992

Chip Dimensions and Pad Layouts

Dimensions in parentheses are in milimeters and are derived

from the basic inch dimensions as indicated. Grid graduations

are in mils (10-3 inch.)

METALLIZATION: Thickness: 11k

Å 14kÅ, AL.

PASSIVATION: 10.4kÅ - 15.6k

Å, Silane

BOND PADS: 0.004 inches X 0.004 inches MIN

DIE THICKNESS: 0.0198 inches - 0.0218 inches

FIGURE 8. TYPICAL PROPAGATION DELAY TIME AS A FUNCTION OF LOAD CAPACITANCE (“A” SELECT TO OUTPUT)

Typical Performance Characteristics (Continued)

AMBIENT TEMPERATURE (TA) = +25oC

SUPPLY VOLTAGE (VDD) = 5V

10V

5V

LOAD CAPACITANCE (CL) (pF)

040

60

80

100

20

0

50

100

150

200

250

300

75

70

60

50

40

30

20

10

0

0

102030

40

50

60

70

78

72-80

(1.829-2.032)

75-83

(1.905-2.108)

4-10

(0.102-0.254)