CD4015BMS

FN3295 Rev 0.00

Page 8 of 8

December 1992

Chip Dimensions and Pad Layout

FIGURE 8. TYPICAL POWER DISSIPATION AS A FUNCTION OF FREQUENCY

Typical Performance Characteristics (Continued)

CL = 50pF

CL = 15pF

AMBIENT TEMPERATURE (TA) = +25oC

SUPPLY VOLTAGE (VDD) = 15V

10V

5V

10V

tr, tf = 20ns

RL = 200k



1

24 6 8

10

24 6 8

102

24 6 8

103

24

6 8

104

24 6 8

CLOCK INPUT FREQUENCY (fCL) (kHz)

105

10

102

2

8

6

4

103

2

8

6

4

104

2

8

6

4

105

2

8

6

4

Dimensions in parentheses are in millimeters

and are derived from the basic inch dimensions

as indicated. Grid graduations are in mils (10-3 inch)

METALLIZATION: Thickness: 11k

Å 14kÅ, AL.

PASSIVATION: 10.4kÅ - 15.6k

Å, Silane

BOND PADS: 0.004 inches X 0.004 inches MIN

DIE THICKNESS: 0.0198 inches - 0.0218 inches

DIE SIZE: X = 80 (77 - 85) = (1.956 - 2.159)

Y = 98 (95 - 103) = (2.413 - 2.616)

13

3

14

15

12

11

10

2

1

16

4

5

6

7

8

9

98

80