FN3294 Rev 0.00

Page 9 of 9

December 1992

CD4014BMS, CD4021BMS

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Chip Dimensions and Pad Layouts

FIGURE 9. TYPICAL POWER DISSIPATION AS A FUNCTION OF FREQUENCY

Typical Performance Characteristics (Continued)

SUPPLY VOLTAGE

(VDD) = 15V

10V

10V

5V

AMBIENT TEMPERATURE (TA) = +25oC

CL = 50pF

CL = 15pF

10

2

4

6

8

102

2

4

6

8

103

2

4

6

8

104

2

4

6

1

24 6 8

10

24 6 8

102

24 6 8

103

24 6 8

104

24 6 8

CLOCK INPUT FREQUENCY (fCL) (kHz)

105

105

METALLIZATION: Thickness: 11k

Å 14kÅ, AL.

PASSIVATION: 10.4kÅ - 15.6k

Å, Silane

BOND PADS: 0.004 inches X 0.004 inches MIN

DIE THICKNESS: 0.0198 inches - 0.0218 inches

Dimensions in parentheses are in millimeters

and are derived from the basic inch dimensions

as indicated. Grid graduations are in mils (10-3 inch)